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從單一控制到整合應用──淺論晶片組的發展歷程

高度整合的晶片組不過是這幾年才發生的事,如果說CPU是電腦的腦部,Chipsets就可算是電腦的心臟了。
CeBIT:智慧手機AMOLED結合觸控顯示吸睛 (2010.03.02)
一年一度的德國漢諾威(CeBIT 2010)大展已經熱烈展開,會中正展示各種令人目不暇給的行動裝置和智慧型手機,其中也揭示出備受矚目的技術發展動向,值得注意的是,AMOLED顯示結合觸控功能的螢幕設計成為焦點,Android手機正在發光發熱,而微軟也會展示其首款Windows Phone 7作業系統的智慧型手機
亞信電子將於IIC-China 2010展出新嵌入式網路晶片 (2010.03.02)
亞信電子於日前宣佈,將在2010年 IIC-China展出多項新產品。包括「普遍應用於Nintendo Wii、Apple MacBook Air、HP Envy 13、UMPC、MID及Netbook等平台的低功耗高速USB 2.0轉10/100M高速乙太網路控制器」、「低功耗 SPI或 Non-PCI乙太網路控制器」等產品
瑞薩新款32位元MCU適用於先進駕駛輔助系統 (2010.03.01)
瑞薩科技近日宣佈,推出適用於先進駕駛輔助系統之SH74552及SH74562兩款32位元MCU,可為汽車「主動安全系統(Active safety)」提供障礙物偵測、危險迴避等功能,並採用小尺寸13 mm × 13 mm封裝、160 MHz高速運作時脈、1 MB高速晶片內建快閃記憶體,及晶片內建功能如4通道CAN
Blackfin Development Tools Bundle (2010.03.01)
For a limited time, you can begin your Blackfin processor design at a discounted rate, over 70% off the regular price. This offer is available from March 1st to May 28th , so order your bundle today to get started.
BLACKFIN USB-LAN EZ-EXTENDER (2010.03.01)
The Blackfin® USB-LAN EZ-Extender daughter board allows developers to connect to the Asynchronous Memory Bus on the ADSP-BF533 EZ-KIT Lite, ADSP-BF537 EZ-KIT Lite and ADSP-BF561 EZ-KIT Lite. The EZ-Extender has peripherals that support USB 2
BLACKFIN EZ-EXTENDER (2010.03.01)
The Blackfin EZ-Extender daughter board allows developers to connect the Parallel Peripheral Interface (PPI) on the ADSP-BF533 EZ-KIT Lite and the ADSP-BF561 EZ-KIT Lite to a number of Analog Devices High Speed Converter (HSC) evaluation boards (ADC, mix signal, and DAC), the OV6630 OmniVision camera evaluation board, and an external LCD display
英飛凌推出Android入門級手機平台 (2010.03.01)
英飛凌科技近日宣佈,推出XMM 6181–Android入門級智慧型手機平台,以滿足主流消費市場的需求。XMM 6181利用高度整合系統解決方案支援Android開放式作業系統,有助於將行動社交網路推向大眾市場
LABVIEW EMBEDDED MODULE FOR ANALOG DEVICES BLACKFIN PROCESSORS (2010.03.01)
The National Instruments LabVIEW™ Embedded Module for Analog Devices Blackfin® Processors is a comprehensive graphical development environment for embedded design. Jointly developed by ADI and NI, this module seamlessly integrates the LabVIEW Development Environment and Blackfin Embedded Processors
LABVIEW EMBEDDED MODULE FOR ANALOG DEVICES BLACKFIN PROCESSORS (2010.03.01)
The National Instruments LabVIEW™ Embedded Module for Analog Devices Blackfin® Processors is a comprehensive graphical development environment for embedded design. Jointly developed by ADI and NI, this module seamlessly integrates the LabVIEW Development Environment and Blackfin Embedded Processors
EZ-KIT LITE EVALUATION KIT FOR ADSP-BF561 BLACKFIN PROCESSOR (2010.03.01)
The ADSP-BF561 EZ-KIT Lite® provides developers with a cost-effective method for initial evaluation of the ADSP-BF561 Blackfin® Processor for audio and video applications via a USB-based PC-hosted tool set. Evaluation of analog audio applications is achieved through the use of the AD1836 multichannel 96 kHz audio codec
EZ-KIT LITE FOR ANALOG DEVICES ADSP-BF537 BLACKFIN PROCESSOR (2010.03.01)
The ADSP-BF537 EZ-KIT Lite® provides developers with a cost-effective method for evaluation of the ADSP-BF537 Blackfin® Processor and its rich set of system peripherals, including the IEEE 802.3 10/100 Ethernet MAC and CAN 2
EZ-KIT LITE FOR THE ADSP-BF533, BF532, BF531 (2010.03.01)
The ADSP-BF533 EZ-KIT Lite provides developers with a cost-effective method for initial evaluation of the ADSP-BF533 Blackfin Processor for a wide range of applications including audio and video processing. The EZ-KIT Lite includes an ADSP-BF533 desktop evaluation board and fundamental debugging software to facilitate architecture evaluations via a USB-based PC-hosted tool set
BF506F EZ-KIT LITE (2010.03.01)
The ADSP-BF506F EZ-KIT Lite® provides developers with a cost-effective method for initial evaluation of the ADSP-BF504/F and BF506F Blackfin® Processors via a USB-based, PC-hosted tool set. With this EZ-KIT Lite, users can learn more about the Analog Devices (ADI) ADSP-BF506F hardware and software development, and quickly prototype a wide range of applications
ADSP-BF527 EZ-KIT LITE EVALUATION KIT (2010.03.01)
The ADSP-BF527 EZ-KIT Lite® provides developers with a cost-effective method for initial evaluation of the ADSP-BF527 Blackfin® Processors via a USB-based, PC-hosted tool set. With this EZ-KIT Lite, users can learn more about the Analog Devices (ADI) ADSP-BF527 hardware and software development, and quickly prototype a wide range of applications
Altair及Aeroflex宣佈針對LTE的協同合作 (2010.03.01)
Altair及Aeroflex近日宣佈針對LTE的協同合作,透過此項合作,Altair和Aeroflex將進行兼容性功能測試(IOT),以共同進行客戶開發和針對預測試和已認證的用戶設備(UE)測試設定進行測試
RAYSPAN發佈用於LTE的突破性天線解決方案 (2010.02.26)
RAYSPAN昨日(2/25)宣佈針對長期演進(LTE)推出RAYSPAN MTM-E解決方案。MTM-E可以支持低頻段698-960 MHz,以及高頻段1710-2170 MHz與2.6 GHz 的6個或6個以上頻段,且無需任何開關元件或匹配電路的天線解決方案
LSI推出全新Axxia通訊處理器 (2010.02.25)
LSI日前宣佈,推出針對無線基礎架構應用所設計的Axxia系列通訊處理器。Axxia通訊處理器採用LSI Virtual Pipeline訊息傳遞技術,可滿足無線應用之要求,提供更快速、更精準的效能,包括視訊串流、網路瀏覽及高品質數位語音等
ST新款加速度計突破尺寸和功耗極限 (2010.02.25)
意法半導體(ST)今(25)日發佈,新系列三軸數位加速度計產品。新產品擁有最小的占板面積、大幅降低的電流消耗以及強化的功能。 意法半導體在加速度計設計方面,將感測器尺寸縮小到2 x 2mm,並將100Hz取樣頻率時的功耗降至10微安培以下(Microampere)
節省空間 英飛凌3G平台加入高階HSPA+功能 (2010.02.25)
英飛凌科技近日宣佈,為其3G輕薄型數據機家族系列推出最新一代平台XMM 6260。XMM 6260平台是專為智慧型手機架構最佳化的輕薄型數據機,除了搭載應用程式處理器,也可單獨作為PC數據機及數據卡解決方案
MWC:LTE將修成正果 VoLTE整合突飛猛進 (2010.02.25)
2月15~18日在西班牙巴賽隆納所舉辦的世界行動通訊大展(MWC 2010)已經順利結束。LTE(Long Term Evolution)依舊是會場上矚目的焦點話題。在此次展會上,LTE在高速寬頻的技術應用上有更進一步的革新,對於LTE的商業化進程也有更為深入的探討

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